Electro-Optics, Enclosures, Products & Instrumentation

Housing of an RF system

הנדסת זיווד אלקטרוני למארז "19
               Project Presentation     



הנדסת זיווד אלקטרוני למארז "19

Top - slotted subrack compatible with a 19 " rack
Bottom - assembled backplane  (rear view)

פיתוח זיווד אלקטרוני למארז סל-כרטיסים הנדסה פיתוח ומימוש זיווד אלקטרוני

Controller assembly

Power supply assembly

פיתוח זיווד אלקטרוני למארז "19 מימוש זיווד אלקטרוני למארז כרטיסים הנדסה פיתוח ומימוש זיווד אלקטרוני

Rear view of several sub enclosures

פתרונות זיווד אלקטרוני לכרטיסי פנל

Front and rear view of a typical front panel

פתרונות זיווד אלקטרוני למכלולים וכרטיסים

Typical sub assembly - 15 configurations realized

פיתוח פתרונות זיווד אלקטרוני כרטיס-אם

Backplane - a double sided connector coupling assembly (located at the rear end)




CSTM R&D Solutions has developed a series of enclosures for Foxcom's  flagship product: the "Platinum" -  communication equipment for distributing satellite signals using optical fibers.
Among  the enclosures realized during the project,  a multi-assembly enclosure for a 19" rack, stood out. This enclosure  was required to contain 25 different configurations of sub- assemblies  for various purposes, in addition to the power supply and controller cards.

The enclosure project was considered  large scale, since it related to thousands of items and covered numerous design details.

CSTM was required as follows:
• to consider electromechanical means of decreasing EMI\RFI problems
• to have the design comply with a given thermal regime
• to solve the electro-mechanical interface problems between circuits
• to adapt a suitable sub-enclosure to each of the sub-assembly configurations
• to relate to various connector types (fiber optic, control, power)
•  to carry a pre-layout mechanical design for all the PCBs

At the end of the concept stage, it was decided to converge upon a solution of 5HP/10HP wide  sub-assemblies packed side by side in a sub-rack enclosure.

Additional requirements
CSTM was requested to meet the following :

A. Cost reduction
In order to reduce production costs, the developers sought to reduce the amount  of parts and to increase the part-to-part uniformity.

Each sub enclosure  consisted of four elements:
- Base circuit
- Cover circuit
- Front Panel
- Back cover

Base - The design converged upon a uniform single shape circuit base (for all the sub- assemblies) which had 5 standoff configurations.
Cover - Each base had a matching cover, thus 5 such configurations were realized.
Front panel - created in 8 different variations
Back cover - was  manufactured in 20 variations of the I/O ports
Consequently it was possible to reduce the number of parts from 100 to 38, some of them being  identical in the metal work  and differ only in their assembly standoffs

B. High reliability
All sub enclosures were connected to a "backplane assembly" containing twelve 55-pin Eurocard connectors. The pins were delicate, and the designers faced a problem to prevent any pin bending during assembly and reassembly. This required a sophisticated tolerance analysis based solution.

C. Regulatory Compliance
The design was reviewed by engineers of a regulation Institute which often came up with essential requirements to which CSTM converged so as to meet the UL60950 standard.

Eventually, mainly due to good tolerancing , the manufacture and integration stages where carried out smoothly:  the enclosure chassis with all its parts have been proved successful at the first round, without any need to carry any further amendments.

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