פיתוח זיווד אלקטרוני ומארזי מתכת

CSTM Engineering delivers electronic enclosure projects of different types. CSTM undertakes layout design, system modeling, heat removal simulation, prototyping and custom tester fabrication. Following is a table which relates to a CORRENT and an INCORRECT way to run a PCB housing project.  The method referred to as “correct” has proved to be efficient and economic

Correct Incorrect
PCB design – synchronized with the enclosure designer The enclosure design is done after the PCB design is completed
Early design of the PCB’s clamping areas PCB clamping is left to areas that remained clear
Early heat removal design from critical components Solve heat problems after the enclosure geometry has been finalised

Work with a layout designer that:
a) obtaines relevant component libraries
b) can generate 3D  IDF* files

 Have the enclosure designer  generate 3D models of  the PCBs
Manufacture the PCBs after the mechanical modeling has been released – in order to follow placement and access problems Manufacture the PCB as early as possible
Preliminary manufcature of the enclosure  for evaluation Manufacture all enclosures in one go
*  IDF stands for Intermediate Data Format. IDF files are 3D files which are composed of sets of two files, one defining the PCB circuit and the second holds the relevant component library. There are several options to prepare IDF files:
emn\emp ,brd\lib , brd\pro , bdf\ldf , idb\idl